SubsTech     
SubsTech     

to Nitride ceramics
to Properties of ceramics

Hot Pressed Silicon Nitride (HPSN)

(submitted by the website administration)

Hot Pressed Silicon Nitride (HPSN)
Chemical composition: Si3N4
Property Value in metric unit Value in US unit
Density 3.3 *10³ kg/m³ 206.0 lb/ft³
Modulus of elasticity 290 GPa 42100 ksi
Flexural strength 950 MPa 137800 psi
Fracture toughness 8 MPa*m½ 8 MPa*m½
Hardness 15000 HV 15000 HV
Thermal expansion (20 ºC) 3.2*10-6 ºCˉ¹ 1.8*10-6 in/(in* ºF)
Thermal conductivity 30 W/(m*K) 208 BTU*in/(hr*ft²*ºF)
Specific heat capacity 780 J/(kg*K) 0.19 BTU/(lb*ºF)
Max. working temperature 1400 ºC 2550 ºF


Related internal links

Related external links

hot_pressed_silicon_nitride_ceramic_hpsn.txt · Last modified: 2012/06/03 by dmitri_kopeliovich
Promote in SubsTech       Creative Commons License Except where otherwise noted, this work is licensed under a Creative Commons Attribution-Noncommercial-Share Alike 3.0 License