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Thermoplastic Polyamide-imide (PAI), electrical grade

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Thermoplastic
Polyamide-imide (PAI), electrical grade
Property Value in metric unit Value in US unit
Density 1.41 *10³ kg/m³ 88 lb/ft³
Water absorption, 24hrs, 20ºC 0.35 % 0.35 %
Tensile modulus 4.1 GPa 600 ksi
Flexural modulus 4.5 GPa 650 ksi
Compressive modulus 4.8 GPa 700 ksi
Tensile strength 138 MPa 20000 psi
Flexural strength 193 MPa 28000 psi
Compressive strength 186 MPa 27000 psi
Elongation 12 % 12 %
Hardness, Rockwell 119 RM 119 RM
IZOD impact strength, notched 112 J/m 2.1 ft-lbs/in
Thermal expansion (20 ºC) 3*10-5 ºCˉ¹ 1.7*10-5 in/(in* ºF)
Thermal conductivity 0.26 W/(m*K) 1.8 BTU*in/(hr*ft²*ºF)
Glass transition temperature 275 ºC 527 ºF
Maximum work temperature 260 ºC 00 ºF
Dielectric strength 23 kV/mm 590 V/mil
Dielectric constant, 1MHz 4.0 - 4.0 -
Dissipation factor, 1MHz 0.02 - 0.02 -
  • Very high dielectric strength;
  • High thermal resistance;
  • Radiation stability;
  • Very good wear resistance;
  • High strength;
  • High stiffness;
  • Low thermal expansion;
  • Good chemical resistance.

Applications: electrical connectors, chip test sockets, motors in radioactive applications semiconductor machinery parts, aerospace components,

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thermoplastic_polyamide-imide_pai_electrical_grade.txt · Last modified: 2023/12/14 by dmitri_kopeliovich
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