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(submitted by the website administration)
| Thermoplastic | ||||
| Polyamide-imide (PAI), electrical grade | ||||
| Property | Value in metric unit | Value in US unit | ||
| Density | 1.41 *10³ | kg/m³ | 88 | lb/ft³ |
|---|---|---|---|---|
| Water absorption, 24hrs, 20ºC | 0.35 | % | 0.35 | % |
| Tensile modulus | 4.1 | GPa | 600 | ksi |
| Flexural modulus | 4.5 | GPa | 650 | ksi |
| Compressive modulus | 4.8 | GPa | 700 | ksi |
| Tensile strength | 138 | MPa | 20000 | psi |
| Flexural strength | 193 | MPa | 28000 | psi |
| Compressive strength | 186 | MPa | 27000 | psi |
| Elongation | 12 | % | 12 | % |
| Hardness, Rockwell | 119 | RM | 119 | RM |
| IZOD impact strength, notched | 112 | J/m | 2.1 | ft-lbs/in |
| Thermal expansion (20 ºC) | 3*10-5 | ºCˉ¹ | 1.7*10-5 | in/(in* ºF) |
| Thermal conductivity | 0.26 | W/(m*K) | 1.8 | BTU*in/(hr*ft²*ºF) |
| Glass transition temperature | 275 | ºC | 527 | ºF |
| Maximum work temperature | 260 | ºC | 00 | ºF |
| Dielectric strength | 23 | kV/mm | 590 | V/mil |
| Dielectric constant, 1MHz | 4.0 | - | 4.0 | - |
| Dissipation factor, 1MHz | 0.02 | - | 0.02 | - |
Applications: electrical connectors, chip test sockets, motors in radioactive applications semiconductor machinery parts, aerospace components,